Qaadashada Modular-xawaaraha Sare ee Is haysta & Mashiinka Goobta YS12F

Astaamaha:

1. Waxqabadka rakibaadda ee 20000 CPH (oo u dhiganta 0.18 sekan/CHIP)

2. U dhigmi kara 0402-45 × 100mm curiye

3. U dhiganta substrate weyn, cabbirka L510 × W460mm

4.Noocyo badan oo ka mid ah qaybaha baakadaha disc, sidoo kale waxay u dhigantaa nooca isweydaarsiga tooska ah

5.Qalabka quudinta saxaarad (ATS15)

6.Suunka gooya ee la dhisay

7.32mm iyo wixii ka sareeya waxay u baahan yihiin rakibaadda qayb ka mid ah tuubada nuugista

La talinta onlaynka ah Nala soo xiriir

Faahfaahinta Alaabta

Qaabka	YS12F (Model: KKJ-100)
PCB lagu dabaqi karo (mm)	L50 x W50 ilaa L640 x W460 (W360 markii ATS15 la rakibay)
Awoodda fuulista	20kCPH - 14k CPH (IPC 9850)
saxnaanta fuulista	Saxnaanta buuxda (μ+3σ): +/- 0.05mm/CHIP(QFP) Ku celcelinta (3σ): +/- 0.03mm/CHIP(QFP)
Qaybaha lagu dabaqi karo	0402(Metric base) ilaa 45 x 100mm, Dhererka ugu badan 15mm, Electrodes nooca kubbadda ah ayaa lagu dabaqi karaa
Tirada noocyada qaybaha	Gariiradda cajalad: 108 nooc (Max., ballac 8mm) Reel: 47 nooc iyo saxaarad: 15 nooc (Markii ATS15 la rakibay)
Cabirka dibadda (mm)	L1,254 x W1,440 x H1,445 (cutubka ugu muhiimsan oo kaliya) L1,254 x W1,755 x H1,470 (Markii ATS15 la rakibay)
Miisaan	Qiyaastii1,250kg (cutubka ugu muhiimsan oo keliya), Qiyaastii1,370kg (Marka ATS15 la rakibo)